Sr. Semiconductor Packaging and Assembly Equipment Engineer (Starlink) at SpaceX
Hawthorne, CA, United States
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal ofenabling human life on Mars.
SR. SEMICONDUCTOR PACKAGING AND ASSEMBLY EQUIPMENT ENGINEER (STARLINK)
SpaceX is actively looking for hands-on experience candidates who poses knowledge of packaging and assembly advanced tools and processes. This role will require to collaborate with a cross-functional and multi-diverse team supporting IC package design, material and process development. This position is focused on equipment engineer to join our emerging and dynamic packaging process and equipment engineering team. This individual will be focused on equipment down selection, qualification and setup to support new product introduction (NPI) products, high volume validation and sustain production for customized silicon products. This engineer will sustain the process and equipment for processes, such as wafer thinning, die singulation, pick & place, flip chip die bonding, under-fill materials and encapsulation molding. Strong technical background in either semiconductor device packaging with knowledge of wafer level packaging industry experience is also desirable. This role assumes ownership of process flow of all associated processes within the packaging process segment as well as with any wafer level packaging processes.
RESPONSIBILITIES:
Own back-end chip scale assembly equipment and utilize hands-on expertise of assembly for flip-chip packaging equipment and process
Bring-up for new product introduction (NPI) and new technology introductions (NTI) for assembly development line
Manage relationships with tool suppliers including continuous improvement plans, cost reduction and productivity improvements
Plan and implement capacity and operational excellence practices while improving cost
Work closely with process engineers, conduct test, and define process window to control the critical dimensions
Lead packaging equipment efficiency and productivity improvement
Project planning including timeline and schedules, risk mitigation and meeting desired project timelines
BASIC QUALIFICATIONS:
Bachelor's degree in chemical engineering, materials science, or other technical discipline
5+ years industry experience with microelectronics packaging development
Experience hands-on working with semiconductor packaging processing equipment
PREFERRED SKILLS AND EXPERIENCE:
Master's degree in chemical engineering, materials science, or other technical discipline
Strong understanding of SPC, lean manufacturing practices, FMEA and safety standards
Demonstrated ability to work in fast-paced environment, flexible and capable of making changes while collaborating with design engineering team
Ability to engage with external suppliers to develop best practices and aware of supplier tools roadmap and competitive landscape
ITAR REQUIREMENTS:
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify the Human Resources Department at (310) 363-6000.
