Silicon Packaging Technology Development Engineer (Starlink) at SpaceX
Hawthorne, CA, United States
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal ofenabling human life on Mars.
SILICON PACKAGING TECHNOLOGY DEVELOPMENT ENGINEER (STARLINK)
SpaceX is actively looking for hands-on experience candidates who poses knowledge of packaging and assembly advanced tools and processes. This position is focused on equipment engineer to join our emerging and dynamic packaging process and equipment engineering team. This individual will be focused on RF based silicon qualification and setup new product introduction (NPI). Strong technical background in either semiconductor device packaging with knowledge of wafer level packaging industry experience is also desirable. This role assumes ownership of process flow of all associated processes within the packaging process segment as well as with any wafer level packaging processes.
RESPONSIBILITIES:
Responsible for total package performance and requirements to qualify process technology, test vehicle design, and validation.
Bring-up for new product introduction (NPI) and new technology introductions (NTI) for flip chip BGA, and system in package assembly development line
Work closely with silicon design engineers, conduct test, and define process window to control the critical dimensions and understanding of design rule challenges for advanced packaging
Comprehensive understanding of multiple relevant packaging technologies (FC-BGA, SiP, AiP)
Manage relationships with tool suppliers including continuous improvement plans, cost reduction and productivity improvements
Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirement
BASIC QUALIFICATIONS:
Bachelor's degree in chemical engineering, materials science, or other technical discipline
3+ years industry experience with microelectronics packaging development
Experience working hands-on with semiconductor packaging processing equipment
PREFERRED SKILLS AND EXPERIENCE:
Advanced degree in chemical engineering, materials science, or other technical discipline
Strong understanding of SPC, lean manufacturing practices, FMEA and safety standards
Demonstrated ability to work in fast-paced environment, flexible and capable of making changes while collaborating with design engineering team
Ability to engage with external suppliers to develop best practices and aware of supplier tools roadmap and competitive landscape
ITAR REQUIREMENTS:
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify the Human Resources Department at (310) 363-6000.
