Job Title: Sr. Associate, Manufacturing Engineer (Semiconductor Process Engineer-Wirebond/Assembly)
Job Code: 16060
Job Location: Mason, OH
Schedule: 9/80; every other Friday off
Job Description:
L3Harris Technologies is seeking a Semiconductor Process Engineer for the Focal Plane Array team at our Mason, OH location. As a Semiconductor Process Engineer, you will support a variety of wafer/die fabrication tools and processes, perform data analysis for development and production work, identify process issues and process optimization opportunities, perform root cause analysis and drive mitigation strategies, perform qualification activities for new processes and tools, and provide sustaining engineering support in a manufacturing area. You will have regular interactions with equipment vendors, operations management, equipment maintenance and a development engineering teams.
This particular role is for the wire bond/assembly area for Focal Plane Arrays
Essential Functions:
Qualify, setup, and operate semiconductor wire bond equipment in a low volume manufacturing environment
Qualify, setup, and operate pick and place equipment in a low volume manufacturing environment
Perform DOEs and process verification to bring new tools and processes online
Develop, optimize, and own wafer processes to drive device performance and yield improvement; create process documentation
Create and routinely monitor statistical process control (SPC) for production processes; identify process drifts and catch potential excursions
Document out of control action plans (OCAPs) for processes failing SPC limits
Identify process and/or equipment issues; Lead investigation efforts for issues related to wafer/die processes
Recommend improvements for efficiency, cost, reliability and quality of existing products; Work with related engineering teams to drive, test, and implement approved plans
Perform on-the-job training for incoming new hires as the team grows
Maintain a safe and organized work environment
Qualifications:
Bachelor's Degree and minimum 2 years of prior relevant experience. Graduate Degree and a minimum of 0 years of prior related experience. In lieu of a degree, minimum of 6 years of prior related experience.
Experience or more in semiconductor wire bond processing operations.
Experience or more in III-V semiconductor wafer/die processing.
Preferred Additional Skills:
Experience in automated wire bonding and/or pick and place programing.
Exceptional organizational, verbal, and written communication skills
Proficient skills in statistical data analysist software(Minitab, JMP, etc)
Strong sense of responsibility, ownership, and follow-through
Must be a team player, pro-active, and customer-oriented with a sense of urgency to accomplish a given task or goal
Ability to train technicians and engineers on processes and equipment used in area of ownership
Lean Six Sigma Certification
Previous experience working in a Class 100 cleanroom or similar
Experience in implementing lean/six sigma techniques (FMEA, DFMA, DTC, DOE, and root cause/corrective action analysis)
L3Harris Technologies is proud to be an Affirmative Action/Equal Opportunity Employer. L3Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws. L3Harris maintains a drug-free workplace and performs pre-employment substance abuse testing and background checks, where permitted by law.
